| Customization: | Available |
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| After-sales Service: | Online |
| Warranty: | 1 Year |
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Plasma Cleaner Laboratory Plasma Cleaning Machine Multilayer Vacuum Plasma Clean Equipment
Pre-Treatment ProcessesPlasma Cleaning Technology
Plasma cleaning technology is performed before many processes and can achieve results with half the effort. The more commonly used processes include:
Based on its inherent characteristics, it is widely applied to:
Electronic Industry:
Packaging Industry:
Printing Industry:
Automotive Industry:
Plastic Industry:
Other Industries:
Plasma Cleaner Laboratory Plasma Cleaning Machine Laboratory 300W 40KHz 10L Square Chamber Vacuum Plasma Cleaning Equipment
Principle of Vacuum Plasma Glow Discharge
The device that generates plasma in plasma cleaning etching machines operates by setting up two electrodes in a sealed chamber to form an electric field, and a vacuum pump is used to achieve a certain degree of vacuum. As the gas becomes increasingly rarefied, the distance between molecules and the free path of molecules or ions also becomes longer. Under the influence of the electric field, they collide and form plasma. These ions are highly reactive, with enough energy to break almost all chemical bonds, causing chemical reactions on any exposed surface. Plasma of different gases has different chemical properties; for example, oxygen plasma has a high degree of oxidizing ability, capable of oxidizing photoresist to form reaction gases, thus achieving the cleaning effect; corrosive gas plasma has good anisotropy, which can meet the needs of etching. Plasma treatment emits a glow, hence it is called glow discharge treatment.
Plasma Cleaner Laboratory Plasma Cleaning Machine Multilayer Vacuum Plasma Clean Equipment
Small vacuum plasma cleaning machine
| Model | PT-20S |
| Chamber Material | Stainless steel with surface treatment |
| Power Supply | AC220V |
| Working Current | Total working current of the machine is not more than 1.2A (excluding vacuum pump) |
| RF Power Supply Power | 0-300W adjustable / 0-600W (select one) |
| RF Frequency | 40KHz (with a deviation of less than 0.2KHz) 13.56MHz for 0-300W / 0-600W (select one) |
| Frequency Deviation | Less than 0.2KHz |
| Vacuum Level | 1pa-30Pa |
| Characteristic Impedance | 50 ohms, automatically matched |
| Gas Path | Dual gas input |
| Gas Flow Rate | 10-160ml/min (adjustable) |
| Process Control | PLC human-machine interface with automatic and manual modes |
| Cleaning Time | 1-99999 seconds adjustable |
| Power Level | 10%-100% adjustable |
| Inner Chamber Dimensions | 260 × 300 × 260mm, 20L |
| External Dimensions | 650 × 550 × 1220mm |
| Vacuum Pump | Feiyue VRD-24 (pumping speed 6L/S) |
| Vacuum Chamber Temperature | Less than 60°C |
| Cooling Method | Forced air cooling |
| Electrode Plate Layers | Odd layer numbers: 1/3/5 layers |
| Plasma Gas | Surface Treatment Process | Application | Excitation Frequency of Plasma Gas |
| Argon (Ar) | Removal of surface contaminants | Wire bonding, Chip bonding, Copper wire frame, PBGA | 13.56MHz or 2.45GHz |
| Oxygen (O2) | Removal of surface organic contaminants | Chip bonding | 13.56MHz |
| Surface etching | Photoresist removal | 13.56MHz | |
| Hydrogen | Removal of surface oxides | Wire bonding, Chip bonding, Copper wire frame, PBGA | 13.56MHz or 2.45GHz |
| CF4 and O2 | Surface etching | Photoresist removal, CSP | 13.56MHz |
| SF6 and O2 | Removal of surface organic materials, Thin film removal | 13.56MHz or 2.45GHz |
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