| Customization: | Available |
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| After-sales Service: | Online |
| Warranty: | 1 Year |
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Plasma Cleaner Microwave Plasma Cleaner Plasma Cleaning Macihne for Plastic and PCB
Pre-Treatment ProcessesPlasma Cleaning Technology
Plasma cleaning technology is performed before many processes and can achieve results with half the effort. The more commonly used processes include:
Based on its inherent characteristics, it is widely applied to:
Electronic Industry:
Packaging Industry:
Printing Industry:
Automotive Industry:
Plastic Industry:
Other Industries:
Plasma Cleaner Microwave Plasma Cleaner Plasma Cleaning Macihne for Plastic and PCB
Principle of Vacuum Plasma Glow Discharge
The device that generates plasma in plasma cleaning etching machines operates by setting up two electrodes in a sealed chamber to form an electric field, and a vacuum pump is used to achieve a certain degree of vacuum. As the gas becomes increasingly rarefied, the distance between molecules and the free path of molecules or ions also becomes longer. Under the influence of the electric field, they collide and form plasma. These ions are highly reactive, with enough energy to break almost all chemical bonds, causing chemical reactions on any exposed surface. Plasma of different gases has different chemical properties; for example, oxygen plasma has a high degree of oxidizing ability, capable of oxidizing photoresist to form reaction gases, thus achieving the cleaning effect; corrosive gas plasma has good anisotropy, which can meet the needs of etching. Plasma treatment emits a glow, hence it is called glow discharge treatment.
| Equipment Dimensions | 1198mm x 1520mm x 1125mm (W x H x D) |
| Weight | 400Kg |
| Required Power Supply | AC380V, 50/60Hz, 5-wire, 30A |
| Plasma Generator Specifications | Power 0~1000W |
| Microwave Power Supply | Frequency 2.45GHz |
| Vacuum System | Dry pump |
| Vacuum Pipeline | All stainless steel pipelines, and high-strength vacuum corrugated pipes |
| Material | Aluminum alloy (customizable stainless steel chamber), thickness 25mm, welded and sealed |
| Chamber Internal Dimensions | 320mm x 200mm x 320mm (W x H x D) |
| Sample Size Range | 6-8 inch wafers, process gases |
| Flow Rate Range | 0~300 SCCM |
| Process Gas Circuit | Standard with two channels, customizable |
| Control System | System control PLC, delivery method 10-inch touch screen |
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